polymer & Multilayer Packaging Analysis for R&D, Quality and PPWR Readiness
Advanced polymer and multilayer packaging analysis using spectroscopy and AI based tools for shelf life prediction, supporting R & D, Q/A, Q/C and PPWR requirements
Advanced polymer and multilayer packaging analysis using spectroscopy and AI based tools for shelf life prediction, supporting R & D, Q/A, Q/C and PPWR requirements
We provide advanced spectroscopic integration combined with AI driven predictive modelling to support data-based decision making across the entire packaging value chain. Our capabilities include accurate shelf life estimation based on AI tools, PPWR - aligned compliance modelling and in-depth material characterisation for multilayer structures and complex polymer systems.
Our solutions are designed to empower R&D teams with rapid formulation insights, enable Q/A departments to validate material performance with higher confidence, and support packaging engineers in developing and redesign structures in preparation for PPWR requirements. From early-stage developments to regulatory readiness and product optimisation, we deliver analytical support tailored to the future needs of the packaging industry.
It means FTIR is not used only for basic "identification" or forensic analysis but is fully integrated into:
rapid material screening;
formulation comparison;
identifying differences between suppliers or batches;
evaluating material compatibility;
batch verification;
detecting process deviation;
confirming actual material composition;
validating incoming materials;
correlating spectral features with functional properties (barrier, stability, degradation);
AI assisted shelf life prediction based on spectral and material data;
predicting material behaviour over time;
measure, verify, redesign;
identifying layers incompatible with recycling;
verifying actual material composition to support compliance assessments;
supporting redesign of multilayer structures;
optical and fluorescence microscopy;
layers thickness;
tie layer depletion measuring films after delamination;
FTIR results, polymer identification, evidence compatibility, tie layer evaluation;
microscopic cross-sectional images and defect analysis;
thickness measurements of layers, variability;
reverse engineering